Reports the testing under cooling season conditions of thermal diode panels incorporating heat pipes. Reports their thermophysical properties were evaluated by measuring temperature distributions in an experimental test facility and by using numerical simulation together with an optimisation procedure. States the method allowed quantification of thermal characteristics for both operating modes - forward and backward heat transfer. Finds that forward heat transfer led to an apparent thermal conductivity up to five times that for the backward mode.
Primary Author(s): Varga S, Oliveira A, et al
Source: Energy Bldgs., 2002, vol.34., no.3, 227-235, 8 figs, 2 tabs, 15 refs.
BSRIA Abstract Doc 000103179 Abs 20020329
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