Electroless silver and copper deposition using reducing agents of a new type ( partner search )


A Lithuanian institute has developed electroless silver and copper deposition technologies using reducing agents - Co( II ) complexes with ammonia and ethylenediamine. The electroless plating processes can be used for the formation of copper and silver coatings on plastics and other dielectrics in production of printed circuits, mirrors, for decorative metallising of plastics. The institute is interested in technical co-operation with potential end-users or metal coatings companies.

Source: MIRC Partner Search

             Reference No.  Silver/02

For more information on this source please contact [email protected]

Date posted on KIBT: 14 May 2003


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